基于ANSYS/LS-DYNA的单颗粒金刚石切割氧化铝陶瓷表面温度场研究
章珈彬，赵礼刚
（江苏科技大学 机械工程学院，江苏 镇江 212000）
摘要：对单颗粒金刚石切割氧化铝陶瓷过程中切削热、表面粗糙度、应变进行研究，通过利用ANSYS/LS-DYNA对切削过程进行3D模拟，热力耦合，分析在不同走丝速度条件下，工件表面裂纹和形貌情况；将切削温度场拟合进切削过程，研究切削热分布以及切削过程中应变问题。仿真结果显示，切削热基本维持在60 ℃左右，且温度传导较慢，范围较小；工件在切削过程中与磨粒底部接触的裂纹深于两侧，且受走丝速度影响较小；脆性材料切削主要以弹性应变为主。
关键词：线锯切割；LS-DYNA；单颗粒；裂纹；热力耦合
中图分类号：TG501 文献标志码：A doi：10.3969/j.issn.1006-0316.2014.04.013文章编号：1006－0316 (2014) 04－0050－04
To study surface temperature field of cutting alumina ceramic with single diamond grain based on the ANSYS/LS-DYNA
ZHANG Jia-bin，ZHAO Li-gang
( School of Mechanical Engineering, Jiangsu University of Science and Technology, Zhenjiang 212000, China )
Abstract：The paper aims to study the cutting heat, surface appearance, strain of the process of cutting alumina ceramic cutting with single diamond grain. By using ANSYS / LS-DYNA to simulate the 3D process of cutting alumina ceramic cutting with single diamond grain, and set up the Thermal-mechanical Coupling model. Then, at the speeds moving wire, the tool stress and the situations of work-piece surface cracks and topography is investigated. The temperature field, and strain distribution are investigated after thermal-mechanical coupling method is considered. Simulation results show that the cutting heat basically maintained at about 60 ℃, it conduces and ranges little. The crack of work-piece contact with abrasive’ bottom is deeper than both sides , and crack was less affected by moving wire speed. Cutting brittle materials based mainly on the elastic strain.
Key words：wire saw；LS-DYNA；single grain；crack；thermal-mechanical coupling；model
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收稿日期：2013－09－22
基金项目：江苏省普通高校研究生科研创新计划资助项目
作者简介：章珈彬（1989－），男，浙江诸暨人，硕士研究生，主要研究方向为特种加工、线锯切割；赵礼刚（1978－），男，博士，研究生导师，主要研究方向为特种加工、精密加工。
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