某模块SOC芯片失效分析及改进
向以鑫，张学新，张云
（中国电子科技集团公司 第三十研究所，四川 成都 610041）
摘要：对某模块在可靠性试验中，出现核心功能失效的故障现象进行了研究。通过有限元仿真分析、金相切片分析结果，定位模块故障原因为SOC芯片存在较大比例焊点开裂现象。针对焊点开裂的原因，采用SOC芯片底部填充胶加固的改进措施，建立对应的有限元仿真模型，进行模态计算、谐响应分析，校核了改进方案的可行性。并对加固后的模块进行可靠性试验、焊点切片分析，进一步验证了模块改进措施的有效性。这种对芯片底部填充胶加固、有限元仿真分析校核、试验及切片验证的设计方法，对同类型芯片焊点加固设计具有参考意义。
关键词：SOC芯片；底部填充胶；焊点开裂；谐响应分析
中图分类号：TN607 文献标志码：A doi：10.3969/j.issn.1006-0316.2022.05.004
文章编号：1006-0316 (2022) 05-0022-06
Failure Analysis and Improvement of a Module SOC Chip
XIANG Yixin，ZHANG Xuexin，ZHANG Yun
( The 30th Research Institute, CETC, Chengdu 610041, China )
Abstract：This paper analyzed the reason why the core function of a module failed in a reliability test. Finite element simulation and cross section analysis were adopted to determine reason of the failure which was proven to be a large proportion of solder joint cracking on soc chip. Based on causes of the solder joint cracking, we adopted underfill reinforcement for soc chip, set up corresponding finite element simulation model and made modal calculation and harmonic response analysis to verify feasibility of the improvement plan. In addition, effectiveness of the structural improvement measures was further approved by reliability tests for the reinforced module and solder joint section analysis. This design method with underfill reinforcement, finite element simulation analysis verification and test as well as section verification has reference significance for solder joint reinforcement design of the same type of chips.
Key words：SOC chip；underfill reinforcement；solder joint cracking；harmonic response analysis
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收稿日期：2022-01-19
作者简介：向以鑫（1989－），男，重庆人，硕士研究生，工程师，主要从事电子设备结构设计工作，E-mail：740799051@qq.com。
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