基于LTCC的微流道制作技术研究
刘俊超
（西南电子技术研究所，四川 成都 610036）
摘要：在微机电系统的集成制造中，无源器件与多芯片的高密度集成对其承载基板的散热性能提出了极高的要求，而在LTCC基板中制作微流道则为满足这一要求提供了一种解决途径。提出了一种应用有机牺牲材料在LTCC中形成微流道的制作方法，实验结果表明该方法可有效抑制微流道成形过程中的变形，并通过将该方法应用于其它瓷片材料的微流道制作，验证了该方法的实用性与通用性。
关键词：微机电系统；LTCC；微流道
中图分类号：TH16 文献标志码：A doi：10.3969/j.issn.1006-0316.2016.06.006
文章编号：1006－0316 (2016) 06－0022－06
Microfluidic channel fabrication technology research for low temperature co-firing ceramic ( LTCC )
LIU Junchao
( Southwest Electronic Technology Institute, Chengdu 610036, China )
Abstract：In integrated fabrication of microelectronic mechanical system (MEMS), high-density integration of passive components and multichip pursue better heat dissipation performance through substrate design improvement. Embedding microfluidic channels in LTCC substrate provides a possible approach for the substrate design improvement. In this paper, a microfluidic channel fabrication method was proposed based on the application of organic sacrifice material. The experimental results demonstrate that, by using this method, the deformation of microfluidic channel can be obviously decreased. This method was also used in the microfluidic channel fabrication of another ceramic material, for validating the practicability and generality of this method.
Key words：MEMS；LTCC；microfluidic channel
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收稿日期：2015－12－29
作者简介：刘俊超（1985－），男，四川成都人，博士，工程师，主要研究方向为微纳制造。
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